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US Patent Issued to KIOXIA on Sept. 8 for "Semiconductor memory device with gate electrode having multiple portions" (Japanese Inventor)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,162, issued on Sept. 8, was assigned to KIOXIA Corp. (Tokyo). "Semiconductor memory device with gate electrode having multiple portions" wa... Read More


US Patent Issued to SAMSUNG ELECTRONICS on Sept. 8 for "Three-dimensional nonvolatile memory device including a plurality of memory cells" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,163, issued on Sept. 8, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Three-dimensional nonvolatile memory device ... Read More


US Patent Issued to Applied Materials on Sept. 8 for "Methods and devices for 3D NAND using silicon-and-halogen-containing materials" (California Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,164, issued on Sept. 8, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Methods and devices for 3D NAND using silicon-and-ha... Read More


US Patent Issued to Kioxia on Sept. 8 for "Semiconductor device and method of manufacturing the same" (Japanese Inventor)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,165, issued on Sept. 8, was assigned to Kioxia Corp. (Tokyo). "Semiconductor device and method of manufacturing the same" was invented by C... Read More


US Patent Issued to SAMSUNG ELECTRONICS on Sept. 8 for "Three-dimensional semiconductor memory device including separation region and electronic system including the same" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,166, issued on Sept. 8, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Three-dimensional semiconductor memory devic... Read More


US Patent Issued to SAMSUNG ELECTRONICS on Sept. 8 for "Bonding type vertical semiconductor devices" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,167, issued on Sept. 8, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Bonding type vertical semiconductor devices"... Read More


US Patent Issued to SUNRISE MEMORY on Sept. 8 for "3-dimensional NOR memory array with very fine pitch: device and method" (California, Oregon Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,168, issued on Sept. 8, was assigned to SUNRISE MEMORY Corp. (San Jose, Calif.). "3-dimensional NOR memory array with very fine pitch: devi... Read More


US Patent Issued to INTEL NDTM US on Sept. 8 for "Barrier and thin spacer for 3D-NAND complementary metal-oxide semiconductor under array" (Chinese, American Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,169, issued on Sept. 8, was assigned to INTEL NDTM US LLC (Santa Clara, Calif.). "Barrier and thin spacer for 3D-NAND complementary metal-o... Read More


US Patent Issued to Kioxia on Sept. 8 for "Semiconductor memory device and method of manufacturing semiconductor memory device" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,170, issued on Sept. 8, was assigned to Kioxia Corp. (Tokyo). "Semiconductor memory device and method of manufacturing semiconductor memory... Read More


US Patent Issued to YANGTZE MEMORY TECHNOLOGIES on Sept. 8 for "Semiconductor device structure and manufacturing method therefor" (Chinese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,171, issued on Sept. 8, was assigned to YANGTZE MEMORY TECHNOLOGIES Co. LTD. (Wuhan, China). "Semiconductor device structure and manufactur... Read More