ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,167, issued on Sept. 8, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Bonding type vertical semiconductor devices" was invented by Samki Kim (Suwon-si, South Korea), Nambin Kim (Suwon-si, South Korea), Taehun Kim (Suwon-si, South Korea), Suhwan Lim (Suwon-si, South Korea) and Hyeongwon Choi (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A vertical semiconductor device includes; a pattern structure including a plurality of insulation patterns and a plurality of gate electrodes that are alternately and repeatedly stacked on a substrate, wherein the pattern structure includes a first gate electrode servin...