US Patent Issued to SAMSUNG ELECTRONICS on Sept. 8 for "Three-dimensional semiconductor memory device including separation region and electronic system including the same" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,166, issued on Sept. 8, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Three-dimensional semiconductor memory device including separation region and electronic system including the same" was invented by Seokcheon Baek (Hwaseong-si, South Korea) and Miram Kwon (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A three-dimensional semiconductor memory device may include a substrate including a first connection region, a first cell region, a separation region, a second cell region, and a second connection region, which are sequentially disposed in a first direction, a stack structure including electrode layers...