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US Patent Issued to SOUTHWEST RESEARCH INSTITUTE on Aug. 18 for "Variable hardness nanocomposite coating" (Texas, North Carolina Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,709,794, issued on Aug. 18, was assigned to SOUTHWEST RESEARCH INSTITUTE (San Antonio). "Variable hardness nanocomposite coating" was invented ... Read More


US Patent Issued to Tokyo Electron on Aug. 18 for "Substrate processing method" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,709,795, issued on Aug. 18, was assigned to Tokyo Electron Ltd. (Tokyo). "Substrate processing method" was invented by Hu Li (Nirasaki City, Ja... Read More


US Patent Issued to ASM IP Holding on Aug. 18 for "Methods of filling a recessed feature on a substrate employing metal sequential infiltration synthesis processes" (Arizona Inventor)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,709,796, issued on Aug. 18, was assigned to ASM IP Holding B.V. (Almere, Netherlands). "Methods of filling a recessed feature on a substrate em... Read More


US Patent Issued to Lam Research on Aug. 18 for "Methods of selective deposition and chemical delivery systems" (American, Indian Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,709,797, issued on Aug. 18, was assigned to Lam Research Corp. (Fremont, Calif.). "Methods of selective deposition and chemical delivery system... Read More


US Patent Issued to KOKUSAI ELECTRIC on Aug. 18 for "Method of manufacturing semiconductor device, method of managing parts, and recording medium" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,709,798, issued on Aug. 18, was assigned to KOKUSAI ELECTRIC Corp. (Tokyo). "Method of manufacturing semiconductor device, method of managing p... Read More


US Patent Issued to Kokusai Electric on Aug. 18 for "Substrate processing apparatus, method of processing substrate, method of manufacturing semiconductor device, recording medium, and exhaust system" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,709,799, issued on Aug. 18, was assigned to Kokusai Electric Corp. (Tokyo). "Substrate processing apparatus, method of processing substrate, me... Read More


US Patent Issued to ASM IP Holding on Aug. 18 for "Methods and apparatus for solid source refill" (Arizona Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,709,800, issued on Aug. 18, was assigned to ASM IP Holding B.V. (Almere, Netherlands). "Methods and apparatus for solid source refill" was inve... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING, NATIONAL TAIWAN UNIVERSITY on Aug. 18 for "Manufacturing method of semiconductor device" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,709,801, issued on Aug. 18, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan) and NATIONAL TAIWAN UNIVERSITY (Ta... Read More


US Patent Issued to ASM IP Holding on Aug. 18 for "Vapor deposition processes" (Finnish Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,709,802, issued on Aug. 18, was assigned to ASM IP Holding B.V. (Almere, Netherlands). "Vapor deposition processes" was invented by Timo Hatanp... Read More


US Patent Issued to Applied Materials on Aug. 18 for "Precursor delivery system for semiconductor device formation" (Indian, American Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,709,803, issued on Aug. 18, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Precursor delivery system for semiconductor device f... Read More