US Patent Issued to KOKUSAI ELECTRIC on Aug. 18 for "Method of manufacturing semiconductor device, method of managing parts, and recording medium" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,709,798, issued on Aug. 18, was assigned to KOKUSAI ELECTRIC Corp. (Tokyo).

"Method of manufacturing semiconductor device, method of managing parts, and recording medium" was invented by Masaya Nishida (Toyama, Japan), Nobuhito Shima (Toyama, Japan), Akihiro Sato (Toyama, Japan), Yosuke Kuwata (Toyama, Japan) and Kenichi Maeda (Toyama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a technique that includes executing a process recipe for processing a substrate; and executing a correction recipe for checking a characteristic value of a supply valve installed at a process gas supply line, wherein the act of executing the correction...