US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING, NATIONAL TAIWAN UNIVERSITY on Aug. 18 for "Manufacturing method of semiconductor device" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,709,801, issued on Aug. 18, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan) and NATIONAL TAIWAN UNIVERSITY (Taipei, Taiwan).

"Manufacturing method of semiconductor device" was invented by Chun-Yi Chou (Hsinchu City, Taiwan), Chih-Piao Chuu (Hsinchu City, Taiwan) and Miin-Jang Chen (Taipei City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes following steps. A first precursor is pulsed over a substrate such that first precursor adsorbs on a first region and a second region of the substrate. A first plurality of the first precursor adsorbing on the first region is then removed using a plasma, whil...