US Patent Issued to Canon on April 21 for "Systems, devices, and methods for registering a superstrate of an imprint tool" (Texas Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,784, issued on April 21, was assigned to Canon K.K. (Tokyo). "Systems, devices, and methods for registering a superstrate of an imprint to... Read More

US Patent Issued to HITACHI on April 21 for "Semiconductor device and method for manufacturing the same" (Japanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,785, issued on April 21, was assigned to HITACHI LTD. (Tokyo). "Semiconductor device and method for manufacturing the same" was invented b... Read More

US Patent Issued to CHANGXIN MEMORY TECHNOLOGIES on April 21 for "Semiconductor layout structure and semiconductor test structure" (Chinese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,786, issued on April 21, was assigned to CHANGXIN MEMORY TECHNOLOGIES INC. (Hefei City, China). "Semiconductor layout structure and semico... Read More

US Patent Issued to NANYA TECHNOLOGY on April 21 for "Asymmetric pads structure and test element group module" (Taiwanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,787, issued on April 21, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Asymmetric pads structure and test element gro... Read More

US Patent Issued to CHANGXIN MEMORY TECHNOLOGIES on April 21 for "Method of processing photoresist layer, and photoresist layer" (Chinese Inventor)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,788, issued on April 21, was assigned to CHANGXIN MEMORY TECHNOLOGIES INC. (Hefei City, China). "Method of processing photoresist layer, a... Read More

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on April 21 for "Method of manufacturing a semiconductor device and pattern formation method" (Taiwanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,789, issued on April 21, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Method of manufacturing a sem... Read More

US Patent Issued to ASM IP Holding on April 21 for "Structure including a photoresist underlayer and method of forming same" (Belgian, Dutch, American Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,790, issued on April 21, was assigned to ASM IP Holding B.V. (Almere, Netherlands). "Structure including a photoresist underlayer and meth... Read More

US Patent Issued to Applied Materials on April 21 for "Method of forming carbon-based spacer for EUV photoresist patterns" (Singaporean, American Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,791, issued on April 21, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Method of forming carbon-based spacer for EUV phot... Read More

US Patent Issued to SiCrystal on April 21 for "Chamfered silicon carbide substrate and method of chamfering" (German Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,792, issued on April 21, was assigned to SiCrystal GmbH (Nuremberg, Germany). "Chamfered silicon carbide substrate and method of chamferin... Read More

US Patent Issued to MACRONIX International on April 21 for "Method of manufacturing memory device" (Taiwanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,793, issued on April 21, was assigned to MACRONIX International Co. Ltd. (Hsinchu, Taiwan). "Method of manufacturing memory device" was in... Read More

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