US Patent Issued to SAMSUNG ELECTRONICS on July 28 for "Interconnect structure having different dimensions for connected circuit blocks in integrated circuit" (New York Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,754, issued on July 28, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (South Korea). "Interconnect structure having different dimensions for... Read More

US Patent Issued to AOI ELECTRONICS on July 28 for "Semiconductor device and method of manufacturing the same" (Japanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,755, issued on July 28, was assigned to AOI ELECTRONICS Co. LTD. (Kagawa, Japan). "Semiconductor device and method of manufacturing the sam... Read More

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 28 for "Interconnection structure and method for fabricating the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,756, issued on July 28, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Interconnection structure and m... Read More

US Patent Issued to INTERNATIONAL BUSINESS MACHINES on July 28 for "Antifuse and resistor" (New York Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,757, issued on July 28, was assigned to INTERNATIONAL BUSINESS MACHINES Corp. (Armonk, N.Y.). "Antifuse and resistor" was invented by Ashim... Read More

US Patent Issued to GlobalFoundries Singapore on July 28 for "Semiconductor devices and methods of forming the same" (Singaporean Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,758, issued on July 28, was assigned to GlobalFoundries Singapore Pte. Ltd. (Singapore). "Semiconductor devices and methods of forming the ... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on July 28 for "Semiconductor structure having low-resistance via contact" (Taiwanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,759, issued on July 28, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor structure having low-... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on July 28 for "Semiconductor device having first heat spreader and second heat spreader and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,760, issued on July 28, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor device having first h... Read More

US Patent Issued to ELEMENT SIX TECHNOLOGIES on July 28 for "Synthetic diamond plates" (British, American Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,761, issued on July 28, was assigned to ELEMENT SIX TECHNOLOGIES Ltd. (Didcot, Great Britain). "Synthetic diamond plates" was invented by J... Read More

US Patent Issued to Siemens on July 28 for "Power semiconductor module comprising at least one power semiconductor element" (German Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,762, issued on July 28, was assigned to Siemens AG (Munich). "Power semiconductor module comprising at least one power semiconductor elemen... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on July 28 for "Heat dissipation in semiconductor devices" (Taiwanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,763, issued on July 28, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Heat dissipation in semiconductor d... Read More

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