US Patent Issued to Taiwan Semiconductor Manufacturing on July 28 for "Heat dissipation in semiconductor devices" (Taiwanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,763, issued on July 28, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Heat dissipation in semiconductor devices" was invented by Zheng-Yong Liang (Kaohsiung City, Taiwan), Wei-Ting Yeh (Hsinchu, Taiwan), Han-De Chen (Hsinchu, Taiwan), Chen-Fong Tsai (Hsinchu, Taiwan), Yu-Yun Peng (Hsinchu, Taiwan) and Keng-Chu Lin (Ping-Tung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit die with two material layers having metal nano-particles and the method of forming the same are provided. The integrated circuit die includes a device layer comprising a first transistor, a first interconnect structure ...