US Patent Issued to SAMSUNG ELECTRONICS on July 28 for "Interconnect structure having different dimensions for connected circuit blocks in integrated circuit" (New York Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,754, issued on July 28, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (South Korea).

"Interconnect structure having different dimensions for connected circuit blocks in integrated circuit" was invented by Eun Sung Kim (Clifton Park, N.Y.), Hyoeun Park (Cohoes, N.Y.) and Kang-ill Seo (Albany, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A interconnect structure for an integrated circuit may include: a metal line including a plurality of sections having different thicknesses along a 1st direction; and a plurality of vias respectively protruding from the plurality of sections of the metal line."

The patent was filed on June 24, 2022, under Appli...