US Patent Issued to Taiwan Semiconductor Manufacturing on July 28 for "Semiconductor device having first heat spreader and second heat spreader and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,760, issued on July 28, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor device having first heat spreader and second heat spreader and manufacturing method thereof" was invented by Shu-Shen Yeh (Taoyuan, Taiwan), Po-Yao Lin (Hsinchu County, Taiwan), Yu-Sheng Lin (Hsinchu, Taiwan), Po-Chen Lai (Hsinchu County, Taiwan) and Shin-Puu Jeng (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a package structure, a first heat spreader, and a second heat spreader. The first heat spreader is aside the package structure. The second heat spreader is in physical contact wi...