US Patent Issued to Eugenus on June 9 for "Multi-region diffusion barrier containing titanium, silicon and nitrogen" (California Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,008, issued on June 9, was assigned to Eugenus Inc. (San Jose, Calif.). "Multi-region diffusion barrier containing titanium, silicon and nit... Read More

US Patent Issued to INTERNATIONAL BUSINESS MACHINES on June 9 for "Negative-tone organic dielectric with fine metal pillar resolution" (New York Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,009, issued on June 9, was assigned to INTERNATIONAL BUSINESS MACHINES Corp. (Armonk, N.Y.). "Negative-tone organic dielectric with fine met... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on June 9 for "Adaptive interconnect structure for semiconductor package" (Taiwanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,010, issued on June 9, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Adaptive interconnect structure for s... Read More

US Patent Issued to Micron Technology on June 9 for "Microelectronic devices including staircase structures and, merged source tier structures, and related memory devices and electronic systems" (Idaho Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,011, issued on June 9, was assigned to Micron Technology Inc. (Boise, Idaho). "Microelectronic devices including staircase structures and, m... Read More

US Patent Issued to Sony Semiconductor Solutions on June 9 for "Semiconductor device with through hole electrode wiring" (Japanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,012, issued on June 9, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan). "Semiconductor device with through hole electro... Read More

US Patent Issued to Micron Technology on June 9 for "Advanced interconnection for wafer on wafer packaging" (American, Italian Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,013, issued on June 9, was assigned to Micron Technology Inc. (Boise, Idaho). "Advanced interconnection for wafer on wafer packaging" was in... Read More

US Patent Issued to SAMSUNG ELECTRONICS on June 9 for "Semiconductor device having via structure vertically penetrating metal layer and substrate" (South Korean Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,014, issued on June 9, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Semiconductor device having via structure v... Read More

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on June 9 for "SRAM middle strap with feedthrough via" (Taiwanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,015, issued on June 9, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "SRAM middle strap with feedthroug... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on June 9 for "Methods of forming metal ion barrier layers and resulting structures" (Taiwanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,016, issued on June 9, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Methods of forming metal ion barrier ... Read More

US Patent Issued to SAMSUNG ELECTRONICS on June 9 for "Interconnect structure of semiconductor device including metal pattern or via structure with sidewall spacer structure" (New York Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,017, issued on June 9, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Interconnect structure of semiconductor device... Read More

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