US Patent Issued to Taiwan Semiconductor Manufacturing on June 9 for "Adaptive interconnect structure for semiconductor package" (Taiwanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,010, issued on June 9, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Adaptive interconnect structure for semiconductor package" was invented by Tung-Liang Shao (Hsinchu, Taiwan), Yu-Sheng Huang (Hemei Township, Taiwan), Wen-Hao Cheng (Hsinchu, Taiwan) and Chen-Hua Yu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package includes a first package component including a semiconductor die, wherein the semiconductor die includes conductive pads, wherein the semiconductor die is surrounded by an encapsulant; an adaptive interconnect structure on the semiconductor die, wherein the adaptive interconnect st...