US Patent Issued to Micron Technology on June 9 for "Advanced interconnection for wafer on wafer packaging" (American, Italian Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,013, issued on June 9, was assigned to Micron Technology Inc. (Boise, Idaho).

"Advanced interconnection for wafer on wafer packaging" was invented by Shyam Surthi (Boise, Idaho) and Onorato Di Cola (Barete, Italy).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device assembly including a first module having one or more memory arrays, each of the one or more memory arrays being connected to a plurality of landing pads of the first module; and a second module having complementary metal-oxide-semiconductor devices, the second module including a plurality of socket shallow trench isolation (STI) regions disposed in a substrate of the secon...