ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,889, issued on Oct. 27, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Susceptor height adjustment" was invented by Vijay D... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,890, issued on Oct. 27, was assigned to NGK INSULATORS Ltd. (Nagoya, Japan). "Member for semiconductor manufacturing apparatus with reduced... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,891, issued on Oct. 27, was assigned to Tokyo Electron Ltd. (Tokyo). "Substrate-processing apparatus" was invented by Riichiro Endo (Miyagi... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,892, issued on Oct. 27, was assigned to TOMOEGAWA Corp. (Tokyo). "Electrostatic chuck" was invented by Ryouji Shikata (Shizuoka, Japan), Yu... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,893, issued on Oct. 27, was assigned to NISSAN CHEMICAL Corp. (Tokyo). "Multilayer body, release agent composition, and method for producin... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,894, issued on Oct. 27, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Method of splitting semiconductor chip using... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,895, issued on Oct. 27, was assigned to Advanced Semiconductor Engineering Inc. (Kaohsiung, Taiwan). "Method of manufacturing circuit patte... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,896, issued on Oct. 27, was assigned to Winbond Electronics Corp. (Taichung City, Taiwan). "Method for detecting seam in film" was invented... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,897, issued on Oct. 27, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package and package-on-package... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,898, issued on Oct. 27, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor device having testing module dispo... Read More