US Patent Issued to NANYA TECHNOLOGY on Oct. 27 for "Semiconductor device having testing module disposed within scribe line and method for manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,898, issued on Oct. 27, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan).

"Semiconductor device having testing module disposed within scribe line and method for manufacturing the same" was invented by Jian-Ping Wu (New Taipei City, Taiwan) and Jui-Hsiu Jao (New Taipei City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device and method for manufacturing the same are provided. The semiconductor device includes a first active region, a second active region, a first testing module, and a second testing module. The second active region is separated by the first active region by a scribe line. The scribe line exte...