US Patent Issued to Tokyo Electron on Oct. 27 for "Substrate-processing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,891, issued on Oct. 27, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate-processing apparatus" was invented by Riichiro Endo (Miyagi, Japan), Takehiro Tanikawa (Miyagi, Japan) and Kazuma Kita (Miyagi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate-processing apparatus includes a substrate support that includes an electrostatic chuck, the electrostatic chuck including a support surface configured to support an annular member. The support surface includes a diffusion groove through which a heat transfer gas is diffused into a gap between the annular member and the support surface. The diffusion groove includes an annular groov...