US Patent Issued to SAMSUNG ELECTRONICS on Oct. 27 for "Semiconductor package and package-on-package having the same" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,897, issued on Oct. 27, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package and package-on-package having the same" was invented by Jaesun Kim (Suwon-si, South Korea), Yunseok Choi (Suwon-si, South Korea) and Youngbae Kim (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes: a redistribution layer including a plurality of conductive lines; a plurality of conductive vias each connected to at least one of the plurality of conductive lines; and a plurality of lower pads each connected to one of the plurality of conductive vias; a semiconductor chip on the redistr...