US Patent Issued to NISSAN CHEMICAL on Oct. 27 for "Multilayer body, release agent composition, and method for producing processed semiconductor substrate" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,893, issued on Oct. 27, was assigned to NISSAN CHEMICAL Corp. (Tokyo).

"Multilayer body, release agent composition, and method for producing processed semiconductor substrate" was invented by Takahisa Okuno (Toyama, Japan), Hiroto Ogata (Toyama, Japan), Masaki Yanai (Toyama, Japan) and Tetsuya Shinjo (Toyama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A laminate having a semiconductor substrate, a support substrate, and an adhesive layer and a release layer disposed between the semiconductor substrate and the support substrate, wherein the release layer is a film formed from a releasing agent composition containing an organic resin, a bran...