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US Patent Issued to TEXAS INSTRUMENTS on Sept. 8 for "Apparatus with overlapping deep trench and shallow trench and method of fabricating the same with low defect density" (Texas Inventor)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,462, issued on Sept. 8, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Apparatus with overlapping deep trench and shallow trench and met... Read More


US Patent Issued to APPLIED MATERIALS on Sept. 8 for "Buffer layer for dielectric protection in physical vapor deposition metal liner applications" (California Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,463, issued on Sept. 8, was assigned to APPLIED MATERIALS Inc. (Santa Clara, Calif.). "Buffer layer for dielectric protection in physical v... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 8 for "Structure having 2D material capping layer and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,464, issued on Sept. 8, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Structure having 2D material cappin... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 8 for "Conductive structures and methods of forming the same" (Taiwanese, American Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,465, issued on Sept. 8, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Conductive structures and methods o... Read More


US Patent Issued to Applied Materials on Sept. 8 for "Integrated PVD tungsten liner and seamless CVD tungsten fill" (California Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,466, issued on Sept. 8, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Integrated PVD tungsten liner and seamless CVD tungs... Read More


US Patent Issued to Georgia Tech Research on Sept. 8 for "Methods for etch barrier deposition and devices made according to the same" (Georgia Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,467, issued on Sept. 8, was assigned to Georgia Tech Research Corp. (Atlanta). "Methods for etch barrier deposition and devices made accord... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Sept. 8 for "Metal structures with seams" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,468, issued on Sept. 8, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Metal structures with seams" wa... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Sept. 8 for "Gate contact structure" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,469, issued on Sept. 8, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Gate contact structure" was inv... Read More


US Patent Issued to Tokyo Electron on Sept. 8 for "Contact patterning" (New York Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,470, issued on Sept. 8, was assigned to Tokyo Electron Ltd. (Tokyo). "Contact patterning" was invented by Hojin Kim (Albany, N.Y.), Minseok... Read More


US Patent Issued to NANYA TECHNOLOGY on Sept. 8 for "Semiconductor device structure with liner layer having tapered sidewall and method for preparing the same" (Taiwanese Inventor)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,471, issued on Sept. 8, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor device structure with liner layer ... Read More