US Patent Issued to APPLIED MATERIALS on Sept. 8 for "Buffer layer for dielectric protection in physical vapor deposition metal liner applications" (California Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,463, issued on Sept. 8, was assigned to APPLIED MATERIALS Inc. (Santa Clara, Calif.).

"Buffer layer for dielectric protection in physical vapor deposition metal liner applications" was invented by Sahil Patel (Sunnyvale, Calif.), Wei Lei (Campbell, Calif.), Xingyao Gao (Sunnyvale, Calif.), Shirish A. Pethe (Cupertino, Calif.) and Yu Lei (Belmont, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods and apparatus for processing a substrate are provided. In some embodiments, a method includes: depositing a metal buffer layer on a substrate and within a feature disposed in a dielectric layer of the substrate. The buffer layer is deposited usin...