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US Patent Issued to Taiwan Semiconductor Manufacturing on April 7 for "Epitaxial formation with treatment and semiconductor devices resulting therefrom" (Taiwanese, American Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,937, issued on April 7, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Epitaxial formation with treatment ... Read More


US Patent Issued to SILTRONIC on April 7 for "Device for drying semiconductor substrates" (German Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,938, issued on April 7, was assigned to SILTRONIC AG (Munich). "Device for drying semiconductor substrates" was invented by Sebastian Geiss... Read More


US Patent Issued to SCREEN Holdings on April 7 for "Substrate bonding device, calculation device, substrate bonding method, and calculation method" (Japanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,939, issued on April 7, was assigned to SCREEN Holdings Co. Ltd. (Kyoto, Japan). "Substrate bonding device, calculation device, substrate b... Read More


US Patent Issued to SCREEN Holdings on April 7 for "Method for measuring temperature" (Japanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,940, issued on April 7, was assigned to SCREEN Holdings Co. Ltd. (Kyoto, Japan). "Method for measuring temperature" was invented by Yukio O... Read More


US Patent Issued to EBARA on April 7 for "Apparatus for processing substrate, device of controlling apparatus for processing substrate, method of controlling apparatus for processing substrate, and storage medium that stores program" (Japanese Inventor)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,941, issued on April 7, was assigned to EBARA Corp. (Tokyo). "Apparatus for processing substrate, device of controlling apparatus for proce... Read More


US Patent Issued to Shanghai Huali Microelectronics on April 7 for "Method for analyzing layout pattern density" (Chinese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,942, issued on April 7, was assigned to Shanghai Huali Microelectronics Corp. (Shanghai). "Method for analyzing layout pattern density" was... Read More


US Patent Issued to ASM IP Holding on April 7 for "Wafer boat system, holder ring and use thereof" (Dutch, Belgian Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,943, issued on April 7, was assigned to ASM IP Holding B.V. (Almere, Netherlands). "Wafer boat system, holder ring and use thereof" was inv... Read More


US Patent Issued to LG Electronics on April 7 for "Chip tray for self-assembly, and method for supplying semiconductor light emitting elements" (South Korean Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,944, issued on April 7, was assigned to LG Electronics Inc. (Seoul, South Korea). "Chip tray for self-assembly, and method for supplying se... Read More


US Patent Issued to Tokyo Electron on April 7 for "Path setting system, path setting method, and software" (Japanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,945, issued on April 7, was assigned to Tokyo Electron Ltd. (Tokyo). "Path setting system, path setting method, and software" was invented ... Read More


US Patent Issued to ASM IP Holding on April 7 for "Fixtures and methods for positioning process kit components within reaction chambers" (Arizona Inventor)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,946, issued on April 7, was assigned to ASM IP Holding B.V. (Almere, Netherlands). "Fixtures and methods for positioning process kit compon... Read More