US Patent Issued to SCREEN Holdings on April 7 for "Substrate bonding device, calculation device, substrate bonding method, and calculation method" (Japanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,939, issued on April 7, was assigned to SCREEN Holdings Co. Ltd. (Kyoto, Japan).

"Substrate bonding device, calculation device, substrate bonding method, and calculation method" was invented by Hajime Mitsuishi (Yokohama, Japan), Isao Sugaya (Kawasaki, Japan), Masaki Tsunoda (Kamakura, Japan), Kazuhiro Suzuki (Tokyo), Takashi Shiomi (Yokohama, Japan) and Minoru Fukuda (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a substrate bonding apparatus comprising: a first holding unit for holding a first substrate; and a second holding unit for holding a second substrate, wherein the substrate bonding apparatus is configured to bond the fi...