US Patent Issued to EBARA on April 7 for "Apparatus for processing substrate, device of controlling apparatus for processing substrate, method of controlling apparatus for processing substrate, and storage medium that stores program" (Japanese Inventor)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,941, issued on April 7, was assigned to EBARA Corp. (Tokyo).

"Apparatus for processing substrate, device of controlling apparatus for processing substrate, method of controlling apparatus for processing substrate, and storage medium that stores program" was invented by Shunsuke Kagaya (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "One object of the present disclosure is to flexibly and promptly save a processing solution in an apparatus for processing a substrate. An apparatus for processing a substrate is configured to change over a transfer time table between an ordinary mode that has a maximum throughput of the apparatus for processing the...