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US Patent Issued to ASM IP Holding on Oct. 20 for "Deposition of flowable SiCN films by plasma enhanced atomic layer deposition" (Japanese, Belgian Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,763, issued on Oct. 20, was assigned to ASM IP Holding B.V. (Almere, Netherlands). "Deposition of flowable SiCN films by plasma enhanced at... Read More


US Patent Issued to Applied Materials, National University of Singapore on Oct. 20 for "Methods of forming conformal silicon oxycarbonitride thin films on high aspect ratio semiconductor structures" (Singaporean, American Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,764, issued on Oct. 20, was assigned to Applied Materials Inc. (Santa Clara, Calif.) and National University of Singapore (Singapore). "Met... Read More


US Patent Issued to COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES on Oct. 20 for "Surface treatment method" (French Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,765, issued on Oct. 20, was assigned to COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES (Paris). "Surface treatment method" ... Read More


US Patent Issued to Applied Materials on Oct. 20 for "Substrate stress management using direct selective area processing" (Massachusetts Inventor)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,766, issued on Oct. 20, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Substrate stress management using direct selective a... Read More


US Patent Issued to NANYA TECHNOLOGY on Oct. 20 for "Method of manufacturing semiconductor structure" (Taiwanese Inventor)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,767, issued on Oct. 20, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Method of manufacturing semiconductor structure"... Read More


US Patent Issued to Kioxia on Oct. 20 for "Semiconductor manufacturing apparatus and method of processing object" (Japanese Inventor)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,768, issued on Oct. 20, was assigned to Kioxia Corp. (Tokyo). "Semiconductor manufacturing apparatus and method of processing object" was i... Read More


US Patent Issued to Winbound Electronics on Oct. 20 for "Manufacturing method of semiconductor structure" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,769, issued on Oct. 20, was assigned to Winbound Electronics Corp. (Taichung City, Taiwan). "Manufacturing method of semiconductor structur... Read More


US Patent Issued to NANYA TECHNOLOGY on Oct. 20 for "Manufacturing method of semiconductor structure" (Taiwanese Inventor)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,770, issued on Oct. 20, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Manufacturing method of semiconductor structure"... Read More


US Patent Issued to UTAC Headquarters on Oct. 20 for "Wafer adaptors, including systems and methods, for adapting different sized wafers" (Singaporean Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,771, issued on Oct. 20, was assigned to UTAC Headquarters Pte. Ltd. (Singapore). "Wafer adaptors, including systems and methods, for adapti... Read More


US Patent Issued to Applied Materials on Oct. 20 for "Mitigation of first wafer effect" (California Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,772, issued on Oct. 20, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Mitigation of first wafer effect" was invented by Yo... Read More