ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,769, issued on Oct. 20, was assigned to Winbound Electronics Corp. (Taichung City, Taiwan).
"Manufacturing method of semiconductor structure" was invented by Kun-Che Wu (Taichung City, Taiwan), Tsung-Wei Lin (Taichung City, Taiwan) and Chungchen Hsu (Taichung City, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A manufacturing method of a semiconductor structure includes the following steps. A substrate is provided. A material layer is formed on the substrate. A first hard mask pattern is formed on the material layer. The top-view pattern of the first hard mask pattern is ring-shaped. The first hard mask pattern has an opening. A second hard ...