US Patent Issued to UTAC Headquarters on Oct. 20 for "Wafer adaptors, including systems and methods, for adapting different sized wafers" (Singaporean Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,771, issued on Oct. 20, was assigned to UTAC Headquarters Pte. Ltd. (Singapore).

"Wafer adaptors, including systems and methods, for adapting different sized wafers" was invented by Enrique E. Sarile Jr. (Singapore), Chee Kay Chow (Singapore) and Dzafir Bin Mohd Shariff (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer adaptor ring assembly for adapting an adapted sized wafer for plasma dicing by a plasma etch chamber designed for dicing a designed sized wafer, which is larger than the adapted sized wafer is disclosed. The wafer adaptor ring assembly includes a primary wafer ring designed for plasma dicing the designed sized wafer by...