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US Patent Issued to Applied Materials on Aug. 4 for "Tantalum doped ruthenium layers for interconnects" (California Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,989, issued on Aug. 4, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Tantalum doped ruthenium layers for interconnects" was... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 4 for "Insulating cap on contact structure" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,990, issued on Aug. 4, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Insulating cap on contact structure" ... Read More


US Patent Issued to TEXAS INSTRUMENTS on Aug. 4 for "Integrated isolation capacitor with enhanced bottom plate" (Texas Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,991, issued on Aug. 4, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Integrated isolation capacitor with enhanced bottom plate" was inve... Read More


US Patent Issued to Micron Technology on Aug. 4 for "Apparatuses including metal-insulator-metal capacitor and methods for forming same" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,992, issued on Aug. 4, was assigned to Micron Technology Inc. (Boise, Idaho). "Apparatuses including metal-insulator-metal capacitor and met... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 4 for "Semiconductor structures and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,993, issued on Aug. 4, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor structures and meth... Read More


US Patent Issued to QUALCOMM on Aug. 4 for "Integrated circuit bumps integrated with Tcoils coupled by way of a metallized via" (California Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,994, issued on Aug. 4, was assigned to QUALCOMM Inc. (San Diego). "Integrated circuit bumps integrated with Tcoils coupled by way of a metal... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 4 for "Back end of line resistor structure" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,995, issued on Aug. 4, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Back end of line resistor structure" ... Read More


US Patent Issued to SAMSUNG ELECTRONICS on Aug. 4 for "Film package" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,996, issued on Aug. 4, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Film package" was invented by Sungeun Jo (Hwas... Read More


US Patent Issued to SAMSUNG ELECTRONICS on Aug. 4 for "Semiconductor package and method of manufacturing the semiconductor package" (South Korean Inventor)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,997, issued on Aug. 4, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Semiconductor package and method of manufac... Read More


US Patent Issued on Aug. 4 for "Heat spreader assembly for use with a semiconductor device" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,998, issued on Aug. 4. "Heat spreader assembly for use with a semiconductor device" was invented by KyungEun Kim (Incheon, South Korea), You... Read More