ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,996, issued on Aug. 4, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).
"Film package" was invented by Sungeun Jo (Hwaseong-si, South Korea), Jaemin Jung (Seoul, South Korea), Jaechoon Kim (Incheon, South Korea), Seunggeol Ryu (Seoul, South Korea) and Kyungsuk Oh (Seongnam-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A film package, includes: a film substrate having first and second surfaces opposing each other; a plurality of wiring patterns respectively including an input pattern, an output pattern, and an interconnection pattern; a first semiconductor chip electrically connected to the input pattern and the i...