US Patent Issued to QUALCOMM on Aug. 4 for "Integrated circuit bumps integrated with Tcoils coupled by way of a metallized via" (California Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,994, issued on Aug. 4, was assigned to QUALCOMM Inc. (San Diego).

"Integrated circuit bumps integrated with Tcoils coupled by way of a metallized via" was invented by Hongmei Liao (San Diego) and Xiaohua Kong (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit (IC) including an IC bump; and a Tcoil situated directly below the IC bump, wherein the Tcoil is electrically coupled to the IC bump by way of a metallized via hole."

The patent was filed on Dec. 14, 2022, under Application No. 18/081,589.

*For further information, including images, charts and tables, please visit: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PT...