ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,159, issued on July 14, was assigned to Microsoft Technology Licensing LLC (Redmond, Wash.). "3D integrated chips with microfluidic cooling... और पढ़ें
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,160, issued on July 14, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package and semiconductor devi... और पढ़ें
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,161, issued on July 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Glass-based cavity and channels for cooling of embedded dies an... और पढ़ें
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,162, issued on July 14, was assigned to Mitsubishi Electric Corp. (Tokyo). "Cooler and semiconductor device" was invented by Naoki Yoshimat... और पढ़ें
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,163, issued on July 14, was assigned to Mitsubishi Electric Corp. (Tokyo). "Semiconductor device" was invented by Tadatsugu Yamamoto (Fukuo... और पढ़ें
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,164, issued on July 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package and cooling system the... और पढ़ें
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,165, issued on July 14, was assigned to GUANGDONG OCEAN UNIVERSITY (Zhanjiang, China). "Chip cooling platform based on micro-nano structure... और पढ़ें
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,166, issued on July 14. "Semiconductor device and method for making the same" was invented by ChangOh Kim (Incheon, South Korea), SeungHyun... और पढ़ें
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,167, issued on July 14, was assigned to Cisco Technology Inc. (San Jose, Calif.). "Heatsink for ring type integrated circuits" was invented... और पढ़ें
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,168, issued on July 14, was assigned to CCHUAN Co. LTD. (Taoyuan City, Taiwan). "Leak-proof heat dissipation structure of high thermal cond... और पढ़ें