ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,166, issued on July 14.

"Semiconductor device and method for making the same" was invented by ChangOh Kim (Incheon, South Korea), SeungHyun Lee (Incheon, South Korea) and HeeSoo Lee (Incheon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device comprises a substrate; a primary semiconductor die attached onto the substrate comprising a front surface and a back surface, wherein the primary semiconductor die has a first region and a second region besides the first region; an auxiliary semiconductor die attached onto the front surface at the first region; a heat transfer block comprising a main body attached onto the front s...