US Patent Issued to SAMSUNG ELECTRONICS on July 14 for "Semiconductor package and cooling system thereof" (South Korean Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,164, issued on July 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor package and cooling system thereof" was invented by Jonggyu Lee (Suwon-si, South Korea), Sunggu Kang (Suwon-si, South Korea), Jaechoon Kim (Suwon-si, South Korea), Taehwan Kim (Suwon-si, South Korea), Hwanjoo Park (Suwon-si, South Korea) and Kyungsuk Oh (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a package substrate; an interposer on the package substrate; a first semiconductor chip on the interposer; at least one second semiconductor chip on the interposer; a molding layer extending ...