ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,162, issued on July 14, was assigned to Mitsubishi Electric Corp. (Tokyo).
"Cooler and semiconductor device" was invented by Naoki Yoshimatsu (Tokyo) and Ryoji Murai (Fukuoka, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a cooler that is less likely to cause an uneven degree of cooling during cooling of multiple cooling targets. The cooler is thus provided inside with a flow path of a refrigerant, the flow path including: an outer-peripheral-side header region that is provided on an outer peripheral side of an annular shape and extends in a circumferential direction of the annular shape; an inner-peripheral-side header region tha...