US Patent Issued to Microsoft Technology Licensing on July 14 for "3D integrated chips with microfluidic cooling" (Canadian, American Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,159, issued on July 14, was assigned to Microsoft Technology Licensing LLC (Redmond, Wash.).

"3D integrated chips with microfluidic cooling" was invented by Bharath Ramakrishnan (Bellevue, Wash.), Husam Atallah Alissa (Redmond, Wash.), Eric C. Peterson (Woodinville, Wash.), Christian L Belady (Mercer Island, Wash.) and Dennis Trieu (Calgary, Canada).

According to the abstract* released by the U.S. Patent & Trademark Office: "A processor includes a first die, a second die connected to the first die with a microfluidic volume positioned between the first die and the second die, at least one pin fin positioned in the microfluidic volume, and a boiling enhancement surface feature pos...