ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,167, issued on July 14, was assigned to Cisco Technology Inc. (San Jose, Calif.).

"Heatsink for ring type integrated circuits" was invented by Yongguo Chen (Shanghai), Kai Cao (Fremont, Calif.), Hua Yang (Tracy, Calif.), Vic Hong Chia (Sunnyvale, Calif.) and Paul Ton (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "The systems and cold plate pedestal and assembly described decrease mechanical stresses in integrated circuits, while also providing efficient thermal coupling between heat producing components and a cold plate. A cold plate assembly includes a cold plate with a pedestal portion a groove formed in a surface of the pedestal...