US Patent Issued to CCHUAN on July 14 for "Leak-proof heat dissipation structure of high thermal conductivity materials" (Taiwanese Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,168, issued on July 14, was assigned to CCHUAN Co. LTD. (Taoyuan City, Taiwan).

"Leak-proof heat dissipation structure of high thermal conductivity materials" was invented by Cheng-Hsiung Chen (Taoyuan City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An improved leak-proof heat dissipation structure of high thermal conductivity materials includes an insulating film layer, a high thermal conductivity thermal interface material layer, a first flexible material composite layer, a second flexible material composite layer and a radiator. The insulating film layer has a film opening at the center. The high thermal conductivity thermal interface...