US Patent Issued to Mitsubishi Electric on July 14 for "Semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,163, issued on July 14, was assigned to Mitsubishi Electric Corp. (Tokyo).

"Semiconductor device" was invented by Tadatsugu Yamamoto (Fukuoka, Japan) and Ryoji Murai (Fukuoka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Heat from a semiconductor device is effectively dissipated while the height of the semiconductor device is kept low. A semiconductor device includes a cooler configured to cool a semiconductor module. The semiconductor module includes: a metal block, a semiconductor element, a terminal connected to the semiconductor element, and a resin covering a part of the terminal, the metal block, and the semiconductor element. The cool...