ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,159, issued on July 14, was assigned to Microsoft Technology Licensing LLC (Redmond, Wash.). "3D integrated chips with microfluidic cooling... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,160, issued on July 14, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package and semiconductor devi... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,161, issued on July 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Glass-based cavity and channels for cooling of embedded dies an... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,162, issued on July 14, was assigned to Mitsubishi Electric Corp. (Tokyo). "Cooler and semiconductor device" was invented by Naoki Yoshimat... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,163, issued on July 14, was assigned to Mitsubishi Electric Corp. (Tokyo). "Semiconductor device" was invented by Tadatsugu Yamamoto (Fukuo... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,164, issued on July 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package and cooling system the... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,165, issued on July 14, was assigned to GUANGDONG OCEAN UNIVERSITY (Zhanjiang, China). "Chip cooling platform based on micro-nano structure... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,166, issued on July 14. "Semiconductor device and method for making the same" was invented by ChangOh Kim (Incheon, South Korea), SeungHyun... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,167, issued on July 14, was assigned to Cisco Technology Inc. (San Jose, Calif.). "Heatsink for ring type integrated circuits" was invented... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,168, issued on July 14, was assigned to CCHUAN Co. LTD. (Taoyuan City, Taiwan). "Leak-proof heat dissipation structure of high thermal cond... Read More