US Patent Issued to Taiwan Semiconductor Manufacturing on May 19 for "Semiconductor processing tool and methods of operation" (Taiwanese, American Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,440, issued on May 19, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor processing tool and met... Read More

US Patent Issued to DISCO on May 19 for "Wafer processing method" (Japanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,441, issued on May 19, was assigned to DISCO Corp. (Tokyo). "Wafer processing method" was invented by Keiichiro Niitsu (Tokyo), Youngsuk Kim... Read More

US Patent Issued to SILTRONIC on May 19 for "Method for cleaning a semiconductor wafer" (German Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,442, issued on May 19, was assigned to SILTRONIC AG (Munich). "Method for cleaning a semiconductor wafer" was invented by Damian Brock (Sank... Read More

US Patent Issued to Tokyo Electron on May 19 for "Pressure adjusting valve and semiconductor manufacturing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,443, issued on May 19, was assigned to Tokyo Electron Ltd. (Tokyo). "Pressure adjusting valve and semiconductor manufacturing apparatus" was... Read More

US Patent Issued to SEMES on May 19 for "Apparatus for treating substrate and method for treating substrate" (South Korean Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,444, issued on May 19, was assigned to SEMES Co. LTD. (Chungcheongnam-Do, South Korea). "Apparatus for treating substrate and method for tre... Read More

US Patent Issued to SILTRONIC on May 19 for "Device for drying semiconductor substrates" (German Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,445, issued on May 19, was assigned to SILTRONIC AG (Munich). "Device for drying semiconductor substrates" was invented by Sebastian Geissle... Read More

US Patent Issued to Tokyo Electron on May 19 for "Substrate processing apparatus and substrate processing method" (Japanese Inventor)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,446, issued on May 19, was assigned to Tokyo Electron Ltd. (Tokyo). "Substrate processing apparatus and substrate processing method" was inv... Read More

US Patent Issued to SCREEN Holdings on May 19 for "Substrate treatment method and substrate treatment device" (Japanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,447, issued on May 19, was assigned to SCREEN Holdings Co. Ltd. (Kyoto, Japan). "Substrate treatment method and substrate treatment device" ... Read More

US Patent Issued to Tokyo Electron on May 19 for "High heat capacity hot plate" (New York Inventor)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,448, issued on May 19, was assigned to Tokyo Electron Ltd. (Tokyo). "High heat capacity hot plate" was invented by Hoyoung Kang (Schenectady... Read More

US Patent Issued to SCREEN Holdings on May 19 for "Heat treatment apparatus" (Japanese Inventor)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,449, issued on May 19, was assigned to SCREEN Holdings Co. Ltd. (Kyoto, Japan). "Heat treatment apparatus" was invented by Satoshi Segawa (K... Read More

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