US Patent Issued to Tokyo Electron on May 19 for "High heat capacity hot plate" (New York Inventor)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,448, issued on May 19, was assigned to Tokyo Electron Ltd. (Tokyo).

"High heat capacity hot plate" was invented by Hoyoung Kang (Schenectady, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "According to an embodiment, an apparatus for a hot plate apparatus is disclosed. The hot plate apparatus includes a housing structure, an alloy, and a heating element. The housing structure includes an outer shell surrounding a cavity. The alloy is disposed of within the cavity. The alloy has a melting temperature range. The heating element is configured to transition the alloy from a solid state to a liquid state at a set temperature between the melting tempe...