US Patent Issued to STMICROELECTRONICS INTERNATIONAL on Aug. 11 for "Semiconductor device and method of forming the same" (French Inventors)

Posted On: 2026-08-12

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,954, issued on Aug. 11, was assigned to STMICROELECTRONICS INTERNATIONAL N.V. (Geneva). "Semiconductor device and method of forming the sam... Read More

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 11 for "Through-substrate-via cell" (Taiwanese Inventors)

Posted On: 2026-08-12

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ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,955, issued on Aug. 11, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Through-substrate-via cell" was... Read More

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 11 for "Memory device having backside power vias" (Taiwanese Inventors)

Posted On: 2026-08-12

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ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,956, issued on Aug. 11, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Memory device having backside p... Read More

US Patent Issued to Infineon Technologies on Aug. 11 for "Silicon carbide device and method for forming a silicon carbide device" (German, Austrian Inventors)

Posted On: 2026-08-12

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ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,957, issued on Aug. 11, was assigned to Infineon Technologies AG (Neubiberg, Germany). "Silicon carbide device and method for forming a sil... Read More

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 11 for "Tunable W-shaped profile for structures" (Taiwanese Inventors)

Posted On: 2026-08-12

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ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,958, issued on Aug. 11, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Tunable W-shaped profile for st... Read More

US Patent Issued to Sandisk Technologies on Aug. 11 for "Three-dimensional memory device containing dummy via cavities and method for making same" (Japanese Inventors)

Posted On: 2026-08-12

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ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,959, issued on Aug. 11, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.). "Three-dimensional memory device containing dummy via... Read More

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 11 for "Method of forming a cap layer for sealing an air gap, and semiconductor device" (Taiwanese Inventor)

Posted On: 2026-08-12

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ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,961, issued on Aug. 11, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Method of forming a cap layer f... Read More

US Patent Issued to Tencent Technology, SUZHOU INSTITUTE OF NANO-TECH & NANO-BIONICS (SINANO) CHINESE ACADEMY OF SCIENCES on Aug. 11 for "Air bridge structure and manufacturing method thereof, and superconducting quantum chip and manufacturing method thereof" (Chinese Inventors)

Posted On: 2026-08-12

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ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,962, issued on Aug. 11, was assigned to Tencent Technology Co. Ltd. (Shenzhen, China) and SUZHOU INSTITUTE OF NANO-TECH & NANO-BIONICS (SINA... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 11 for "Semiconductor devices including backside capacitors and methods of manufacture" (Taiwanese Inventors)

Posted On: 2026-08-12

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ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,963, issued on Aug. 11, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor devices including bac... Read More

US Patent Issued to Adeia Semiconductor Bonding Technologies on Aug. 11 for "Stacked inductors in multi-die stacking" (California, North Carolina Inventors)

Posted On: 2026-08-12

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ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,964, issued on Aug. 11, was assigned to Adeia Semiconductor Bonding Technologies Inc (San Jose, Calif.). "Stacked inductors in multi-die st... Read More

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US Patent Issued to STMICROELECTRONICS INTERNATIONAL on Aug. 11 for "Semiconductor device and method of forming the same" (French Inventors)

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 11 for "Through-substrate-via cell" (Taiwanese Inventors)

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 11 for "Memory device having backside power vias" (Taiwanese Inventors)

US Patent Issued to Infineon Technologies on Aug. 11 for "Silicon carbide device and method for forming a silicon carbide device" (German, Austrian Inventors)

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 11 for "Tunable W-shaped profile for structures" (Taiwanese Inventors)

US Patent Issued to Sandisk Technologies on Aug. 11 for "Three-dimensional memory device containing dummy via cavities and method for making same" (Japanese Inventors)

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 11 for "Method of forming a cap layer for sealing an air gap, and semiconductor device" (Taiwanese Inventor)

US Patent Issued to Tencent Technology, SUZHOU INSTITUTE OF NANO-TECH & NANO-BIONICS (SINANO) CHINESE ACADEMY OF SCIENCES on Aug. 11 for "Air bridge structure and manufacturing method thereof, and superconducting quantum chip and manufacturing method thereof" (Chinese Inventors)

US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 11 for "Semiconductor devices including backside capacitors and methods of manufacture" (Taiwanese Inventors)

US Patent Issued to Adeia Semiconductor Bonding Technologies on Aug. 11 for "Stacked inductors in multi-die stacking" (California, North Carolina Inventors)