ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,958, issued on Aug. 11, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).
"Tunable W-shaped profile for structures" was invented by Jih-Sheng Yang (Hsinchu, Taiwan), Li-Wei Yin (Hsinchu, Taiwan), Yu-Hsien Lin (Kaohsiung, Taiwan), Tzu-Wen Pan (Hsinchu, Taiwan), Shih-Chieh Chao (Taichung, Taiwan), Chia Ming Liang (Taipei, Taiwan), Yih-Ann Lin (Hsinchu, Taiwan) and Ryan Chia-Jen Chen (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are structures and methods for forming structures with surfaces having a W-shaped profile. An exemplary method includes differentially etching a gate material to a rec...