US Patent Issued to Adeia Semiconductor Bonding Technologies on Aug. 11 for "Stacked inductors in multi-die stacking" (California, North Carolina Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,964, issued on Aug. 11, was assigned to Adeia Semiconductor Bonding Technologies Inc (San Jose, Calif.).

"Stacked inductors in multi-die stacking" was invented by Guilian Gao (San Jose, Calif.), Gaius Gillman Fountain Jr. (Youngsville, N.C.), Belgacem Haba (Saratoga, Calif.) and Rajesh Katkar (Milpitas, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Microelectronic devices having stacked electromagnetic coils are disclosed. In one example, a microelectronic device can include a first semiconductor element and a second semiconductor element disposed on the first semiconductor element. The microelectronic device can also include an electromagne...