ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,955, issued on Aug. 11, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).
"Through-substrate-via cell" was invented by Yun-Sheng Li (Hsinchu, Taiwan), Chih Hsin Yang (Hsinchu County, Taiwan), Chih-Chieh Chang (Hsinchu, Taiwan), Mao-Nan Wang (Kaohsiung, Taiwan), Kuan-Hsun Wang (Hsinchu City, Taiwan) and Yang-Hsin Shih (Hsinchu City, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure according to the present disclosure includes a substrate; a through substrate via (TSV) cell over the substrate; and a TSV extending through the TSV cell and the substrate. The TSV cell includes a guard ring st...