ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,428, issued on Sept. 8, was assigned to SCREEN Holdings Co. Ltd. (Kyoto, Japan). "Substrate treating apparatus and substrate treating metho... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,429, issued on Sept. 8, was assigned to NGK INSULATORS Ltd. (Nagoya-City, Japan). "Plug, method of manufacturing plug, and member for semic... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,430, issued on Sept. 8, was assigned to Kioxia Corp. (Tokyo). "Semiconductor manufacturing apparatus" was invented by Taishi Nakahara (Kuwa... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,431, issued on Sept. 8, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD (Hsinchu, Taiwan). "Semiconductor system with an int... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,432, issued on Sept. 8, was assigned to Tokyo Electron Ltd. (Tokyo). "Substrate processing system and maintenance method" was invented by T... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,433, issued on Sept. 8, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan). "Semiconductor apparatus, temperature compens... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,434, issued on Sept. 8, was assigned to Tokyo Electron Ltd. (Tokyo). "Measurement jig and processing method" was invented by Masakazu Yamam... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,435, issued on Sept. 8, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Redistribution layer metallic l... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,436, issued on Sept. 8, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Multi-zone platen temperature control" was invented ... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,437, issued on Sept. 8, was assigned to Tokyo Electron Ltd. (Tokyo). "Substrate processing system and substrate transfer method" was invent... Read More