US Patent Issued to Sony Semiconductor Solutions on Sept. 8 for "Semiconductor apparatus, temperature compensation system, and alarm system" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,433, issued on Sept. 8, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan).

"Semiconductor apparatus, temperature compensation system, and alarm system" was invented by Kaihei Hotta (Kanagawa, Japan), Kyoichi Takenaka (Kanagawa, Japan) and Naoki Kawazu (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An object of the present invention is to provide a semiconductor apparatus capable of recognizing the actual temperature for each semiconductor chip even while driving the device.A semiconductor apparatus of the present disclosure includes a semiconductor chip, a plurality of pad electrodes formed in the semiconductor ch...