US Patent Issued to Kioxia on Sept. 8 for "Semiconductor manufacturing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,430, issued on Sept. 8, was assigned to Kioxia Corp. (Tokyo).

"Semiconductor manufacturing apparatus" was invented by Taishi Nakahara (Kuwana Mie, Japan) and Takeori Maeda (Mie Mie, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor manufacturing apparatus according to the present embodiment includes a push-up device, a transfer device, an electronic component holding device, and a mounting device. The push-up device is capable of pushing up a plurality of adjacent electronic components among a plurality of electronic components diced from a wafer. The transfer device is capable of transferring the plurality of electronic component...