ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,875, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package" was invented by Dongkyu... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,876, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Display module including bonding member connec... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,877, issued on Nov. 3, was assigned to XIAMEN EXTREMELY PQ DISPLAY TECHNOLOGY Co. LTD. (Xiamen, China). "Micro light emitting diode chip and... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,878, issued on Nov. 3, was assigned to QUALCOMM Inc. (San Diego). "Stacked integrated circuit devices" was invented by Yue Li (San Diego), R... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,879, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Semiconductor chip and semiconductor packag... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,880, issued on Nov. 3, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Dual-side bridge chips connecting two semicond... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,881, issued on Nov. 3, was assigned to Infineon Technologies AG (Neubiberg, Germany). "3D-IC for RF applications" was invented by Hans Taddi... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,882, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package and method of manufactur... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,883, issued on Nov. 3, was assigned to MediaTek Inc. (Hsinchu City, Taiwan). "Semiconductor package and fabrication method thereof" was inve... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,884, issued on Nov. 3, was assigned to WUHAN XINXIN SEMICONDUCTOR MANUFACTURING Co. LTD. (Wuhan, China). "Semiconductor device having deep t... Read More