US Patent Issued to SAMSUNG ELECTRONICS on Nov. 3 for "Semiconductor chip and semiconductor package including the same" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,879, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Semiconductor chip and semiconductor package including the same" was invented by Jihun Jung (Suwon-si, South Korea), Unbyoung Kang (Suwon-si, South Korea), Yeongkwon Ko (Suwon-si, South Korea) and Seunghun Shin (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor chip including a semiconductor substrate having an active surface and a non-active surface opposite to each other, a plurality of through electrodes passing through the semiconductor substrate, a plurality of wiring structures on the active surface and electricall...